用户名: 密码:    忘记密码   注册   在线充值
环境试验.试验.试验Td.表面安装设备(SMD)的可焊性,耐金属化溶融和耐焊接热试验方法  
 【英文标准名称】  Environmental testing - Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
 【原文标准名称】  环境试验.试验.试验Td.表面安装设备(SMD)的可焊性,耐金属化溶融和耐焊接热试验方法
 【标准号】  BS EN 60068-2-58-2004
 【标准状态】  ST
 【国别】  英国
 【发布日期】  2004-11-19
 【实施或试行日期】  2004-11-19
 【发布单位】  英国标准学会(GB-BSI)
 【起草单位】  BSI
 【标准类型】  ()
 【标准水平】  ()
 【中文主题词】  铜焊;组件;定义;定义(术语);溶解;电气器具;电气设备;电气元件;电气工程;电子工程;电子设备及元件;环境测试;架设(施工作业);热浸涂敷;喷镀金属;表面安装设备;软钎焊性;软钎焊性试验;软钎焊;金属熔化槽方法;焊接热;耐钎焊温度;钎焊;材料强度;表面安装装置;试验;测试条件;热稳定性
 【英文主题词】  Brazing;Components;Definition;Definitions;Dissolution;Electric appliances;Electrical appliances;Electrical components;Electrical engineering;Electronic engineering;Electronic equipment and components;Environmental testing;Erecting (construction operation);Hot dip coating;Metallization;SMD;Solderability;Solderability testing;Soldering;Soldering bath method;Soldering heat;Soldering temperature resistance;Solderings;Strength of materials;Surface mounting devices;Testing;Testing conditions;Thermal stability
 【摘要】  This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. The procedures in this standard include the solder bath method and reflow method. The solder bath method is applicable to the SMD designed for flow soldering and the SMD designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMD for reflow soldering and when the solder bath (dipping) method is not appropriate. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-2 using each of the soldering methods specified in IEC 61760-1. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering.
 【中国标准分类号】  K04;L04
 【国际标准分类号】  19_040
 【页数】  30P;A4
 【正文语种】  英语
索取全文
标准全文由山东省标准化研究院向您提供(不能使用知网账号下载全文),需向山东省标准化研究院支付相关费用后,方可获得标准。

 

       

标准间关联  
本领域专利与科技成果  
本标准研制背景
本标准应用动态
所涉核心技术研究动态
京ICP证040431号 互联网出版许可证 新出网证(京)字008号 京公网安备11010802014875号
© 2014中国知网(CNKI) 《中国学术期刊(光盘版)》电子杂志社有限公司
服务热线:400-810-9888 订卡热线:800-810-6613
在线咨询:http://help.cnki.net 客服中心:http://service.cnki.net 电子邮件:help@cnki.net