用户名: 密码:    忘记密码   注册   在线充值
半导体器件.机械和气候试验方法.第20-1部分:对潮湿和焊接热综合效应敏感元器件的操作,包装,标识和运输  
 【英文标准名称】  Semiconductor devices - Mechanical and climatic test methods - Part 20-1:Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
 【原文标准名称】  半导体器件.机械和气候试验方法.第20-1部分:对潮湿和焊接热综合效应敏感元器件的操作,包装,标识和运输
 【标准号】  BS EN 60749-20-1-2009
 【标准状态】  ST
 【国别】  英国
 【发布日期】  2009-07-31
 【实施或试行日期】  2009-07-31
 【发布单位】  英国标准学会(GB-BSI)
 【起草单位】  BSI
 【标准类型】  ()
 【标准水平】  ()
 【中文主题词】  气候试验;元部件;电气工程;电子工程;电子设备及元件;热学;集成电路;加标签;机械测试;潮气;抗湿;包装件;包装试验;塑料;耐力;半导体器件;半导体;航运;表面安装设备;耐钎焊温度;表面安装;表面安装装置;测试;运输
 【英文主题词】  Climatic tests;Components;Electrical engineering;Electronic engineering;Electronic equipment and components;Heat;Integrated circuits;Labelling;Mechanical testing;Moisture;Moisture resistance;Packages;Packaging tests;Plastics;Resistance;Semiconductor devices;Semiconductors;Shipping;SMD;Soldering temperature resistance;Surface mounting;Surface mounting devices;Testing;Transport
 【摘要】  This part of IEC 60749 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air.The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs which have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date.Two test conditions, method A and method B, are specified in the soldering heat test of IEC 60749-20. For method A, moisture soak conditions are specified on the assumption that moisture content inside the moisture barrier bag is less than 30 % RH. For method B, moisture soaking conditions are specified on the assumption that manufacturer’s exposure time (MET) does not exceed 24 h and the moisture content inside the moisture barrier bag isless than 10 % RH. In an actual handling environment, SMDs tested by method A are permitted to absorb moisture up to 30 % RH, and SMDs tested by method B are permitted to absorb moisture up to 10 % RH. This standard specifies the handling conditions for SMDs subjected to the above test conditions.
 【中国标准分类号】  L40
 【国际标准分类号】  31_080_01
 【页数】  38P.;A4
 【正文语种】  英语
索取全文
标准全文由山东省标准化研究院向您提供(不能使用知网账号下载全文),需向山东省标准化研究院支付相关费用后,方可获得标准。

 

       

标准间关联  
本领域专利与科技成果  
本标准研制背景
本标准应用动态
所涉核心技术研究动态
京ICP证040431号 互联网出版许可证 新出网证(京)字008号 京公网安备11010802014875号
© 2014中国知网(CNKI) 《中国学术期刊(光盘版)》电子杂志社有限公司
服务热线:400-810-9888 订卡热线:800-810-6613
在线咨询:http://help.cnki.net 客服中心:http://service.cnki.net 电子邮件:help@cnki.net